Thermal management solutions

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Izaberi proizvodDIATHERM Thermal PadsDOWSIL TC-3065 Thermal GelDOWSIL TC-4040 Dispensable Thermal PadDOWSIL TC-4515 Thermally Conductive Gap FillerDOWSIL TC-4525 Thermally Conductive Gap FillerDOWSIL TC-4535 CV Thermally Conductive Gap FillerDOWSIL TC-5150 Thermally Conductive Gap FillerDOWSIL TC-5550 Thermal Conductive Compound DOWSIL TC-6010 Thermally Conductive EncapsulantELECTROLUBE ER2074 – Epoxy ResinELECTROLUBE ER2183 – Epoxy ResinELECTROLUBE HTC – Non-silicone Heat Transfer CompoundELECTROLUBE HTCP – Heat Transfer Compound Plus - Non SiliconeELECTROLUBE HTCPX – Non-Silicone Heat Transfer Compound PLUS XtraELECTROLUBE HTCPX_LV12.5K – Non-Silicone Heat Transfer Plus - Low ViscosityELECTROLUBE HTCX – Heat Transfer Compound Xtra - Non SiliconeELECTROLUBE HTS – Silicone Heat Transfer CompoundELECTROLUBE HTSP – Silicone Heat Transfer Compound PlusELECTROLUBE TCOR – Thermally Conductive Oxime RTVThermal management solutions

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THERMAL MANAGEMENT SOLUTIONS

Pošalji upit za ovaj proizvod!

With the ever-progressing development and downsizing it is crucial to effectively dissipate heat from electronic components which are generate significant amounts of heat. Failure to effectively dissipate this heat away from the component and the device can lead to reliability concerns and reduced operational lifetimes. Our extensive Thermal Interface Material (TIM) Range is designed to help reduce the operating temperature of many different electronic devices. With any thermal application we would always advise testing before final selection as the requirements and operating environment will vary for each application.

We can provide you:

• Silicone based & Non-Silicone Thermal Pastes 
• Thermal Gap Fillers
• Phase Change Materials 
• Silicone & Non-Silicone Gap Pads 
• RTVs and Bonding Products 
• Encapsulation Resins 
• Thermal insulators 
• Thermal graphite sheets 
• Thermal tapes 
• Up to 5.5W/m.K thermal conductivity

Pdf:

• Tecnite Thermal Interface Materials.pdf
• Electrolube Thermal Brochure GB V2.pdf
• DOWSIL Thermally Conductive Materials Selection Guide.pdf