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TECHCON TS9000 Series Jet Tech Valve

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Techcon Systems

TECHCON TS9000 SERIES JET TECH VALVE

TECHCON TS9000 Series Jet Tech Valve

TECHCON TS9000 Series Jet Tech ValveTECHCON TS9000 Series Jet Tech Valve
Pošalji upit za ovaj proizvod!
The TS9000 Series Jet Tech is a Piezoelectric driven, non contact dispense valve capable of handling fluid viscosities to 2 million Cps. Jet Tech offers a fast jetting action producing hundreds of accurate deposits less than one second.Every component of the valve was designed to the highest tolerances and manufactured to the strictest degree of precision insuring world class accuracy and repeatability in drop-to-drop dispensing volume. Jet Tech's compact size and modular design aids integration into robotic systems. The valve features fully adjustable parameter settings, allowing the operator to change the jetting properties for different fluid types and optimize the process for repeatable dispensing. A variety of nozzles shape and sizes along with different tappet configurations provides a wide spectrum of output jet deposits. 

Features:
  • Non contact Jetting technology
  • Accurate and precise dispensing
  • Extremely high speed, up to 1000Hz
  • Repeatable drop size as small as 2 nl
  • Jet Fluid from 7K to 2 million Cps
  • Small modular design
  • Easy and fast cleaning
  • Field replaceable spare parts
  • Low total cost of ownership

Specifications:
  • Size Valve W x L x H: 115mm x 39.5mm x 12mm 
  • Size Controller W x L x H: 101.6mm x 295mm x 128.4mm 
  • Weight Valve: 258g 
  • Weight Controller: 1600g 
  • Minimum Shot Size: 2 nl 
  • Viscosity Range: 7000 to 2Milion Cps 
  • Fluid Pressure Range: 0.1 to 8.0bar 
  • Nozzle Orifice Diameter Range: 0.07mm to 0.40mm 
  • Max. Dispensing Frequency: 1000 Hz 
  • Power Connection: 10 sets internally; unlimited externally 
  • Standard Interface: RS232; 25V/ 5V PLC 
  • Operating Temperature: 10°C to 50°C

Applications:
The TS9000 Jet Tech can be used in wide range of applications. Some examples of processes and applications are:

  • Jetting silver epoxies for die bonding processes
  • Jetting silicone phosphor in the LED assembly process
  • Jetting under-fill in micro-electronic package applications on PCBA
  • Jetting micro dots of UV adhesive in medical device applications
Video:

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TECHCON TS9000 SERIES JET TECH VALVE




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Cookie Policy
The Ulbrich Group wants to offer you the best service possible. To achieve this, we save information about your visit in so-called cookies. By using this website, you consent to the use of cookies. You can click on the 'Additional information' button to find detailed information on the use of cookies on this website. You can also prevent cookies from being used by changing your browser settings.

Additional information

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