PERMABOND UV685

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Permabond

PERMABOND UV685

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PERMABOND UV685 has been developed for use as a coating. It is ideal for coating and doming applications. The optically clear / tack free formulation also makes this product particularly suitable for coating smart card microchips amongst various other applications. Its viscosity makes it suitable for encapsulation of electronic components and its high temperature resistance allows it to resist wave‐soldering.

Features & Benefits

• Cure on demand 
• Ideal viscosity for doming 
• Tack free 
• Fast curing with low‐power lamps 
• 100% solids, no solvents

Properties
Tensile strength: 8 ‐ 15 N/mm²
Elongation: 40‐70%
Hardness: 60 ‐ 70 Shore D
Viscosity 20rpm: 4000‐8000 mPa.s
Fixture time: <5 sec 
Appearance: Colourless gel

Pdf:

• TDS PERMABOND UV685 eng.pdf