PERMABOND 1K ES560

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Izaberi proizvodAbout 2-part EpoxiesAbout Single Part EpoxiesPERMABOND 1K ES550PERMABOND 1K ES5505 High Temperature EpoxyPERMABOND 1K ES558PERMABOND 1K ES560PERMABOND 1K ES561PERMABOND 1K ES562PERMABOND 1K ES566PERMABOND 1K ES568PERMABOND 1K ES5681PERMABOND 1K ES569PERMABOND 1K ES5691PERMABOND 1K ES5722PERMABOND 1K ES5741PERMABOND 1K ES5748PERMABOND 1K ES578PERMABOND 1K ES579PERMABOND 2K ET500PERMABOND 2K ET505PERMABOND 2K ET510PERMABOND 2K ET514PERMABOND 2K ET515PERMABOND 2K ET536PERMABOND 2K ET5364PERMABOND 2K ET538PERMABOND 2K ET540PERMABOND 2K ET5401PERMABOND 2K ET5411 High Temperature Resistant EpoxyPERMABOND 2K MT3809PERMABOND 2K MT382PERMABOND 2K MT3821

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Permabond

PERMABOND 1K ES560

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PERMABOND ES560 is a single-part epoxy adhesive which flows when heated. It is unfilled and selflevelling, making it particularly suitable for electronics potting and encapsulation applications, as well as underfilling and reworking microchips. It has excellent thermal conductivity and shock resistance.

Features & Benefits

• Excellent adhesive strength 
• Excellent resistance to vibration 
• Easy to use – no mixing required 
• Low viscosity

Properties
Shear strength (Steel): 14-20 N/mm²
Hardness: 80 Shore D
Viscosity: 1,000-3,000 mPa.s
max. gap fill: 0.1 mm
Cure speed 120°C: 40 min
Appearance: Cured – translucent

Pdf:

• TDS PERMABOND 1K ES560 eng.pdf