ELECTROLUBE HTCPX_LV12.5K – Non-Silicone Heat Transfer Plus - Low Viscosity

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Izaberi proizvodDIATHERM Thermal PadsDOWSIL TC-3065 Thermal GelDOWSIL TC-4040 Dispensable Thermal PadDOWSIL TC-4515 Thermally Conductive Gap FillerDOWSIL TC-4525 Thermally Conductive Gap FillerDOWSIL TC-4535 CV Thermally Conductive Gap FillerDOWSIL TC-5150 Thermally Conductive Gap FillerDOWSIL TC-5550 Thermal Conductive Compound DOWSIL TC-6010 Thermally Conductive EncapsulantELECTROLUBE ER2074 – Epoxy ResinELECTROLUBE ER2183 – Epoxy ResinELECTROLUBE HTC – Non-silicone Heat Transfer CompoundELECTROLUBE HTCP – Heat Transfer Compound Plus - Non SiliconeELECTROLUBE HTCPX – Non-Silicone Heat Transfer Compound PLUS XtraELECTROLUBE HTCPX_LV12.5K – Non-Silicone Heat Transfer Plus - Low ViscosityELECTROLUBE HTCX – Heat Transfer Compound Xtra - Non SiliconeELECTROLUBE HTS – Silicone Heat Transfer CompoundELECTROLUBE HTSP – Silicone Heat Transfer Compound PlusELECTROLUBE TCOR – Thermally Conductive Oxime RTVThermal management solutions

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Electrolube

ELECTROLUBE HTCPX_LV12.5K – NON-SILICONE HEAT TRANSFER PLUS - LOW VISCOSITY

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HTCPX-LV provides the ultimate in thermal conductivity together with the advantage of a relatively low viscosity, making it suitable for a range of application methods. The exceptional properties obtained from HTCPX-LV are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

Features

• Excellent non-creep characteristics 
• Wide operating temperature range 
• Excellent thermal conductivity even at high temperatures 
• Easy to handle 
• Low in toxicity 
• Light colour enables treated parts to be easily identified 
• Low evaporation weight loss

Pdf:

• TDS ELECTROLUBE HTCPX LV12 5K Non Silicone Heat Transfer Plus Low Viscosity eng.pdf