DOWSIL TC-5150 Thermally Conductive Gap Filler

Trenutno se nalazite: Proizvodi> Kemijsko - tehnički proizvodi> Elektro-kemikalije> Proizvodi za odvajanje topline> DOWSIL TC-5150 Thermally Conductive Gap Filler

Izaberi proizvodDIATHERM Thermal PadsDOWSIL TC-3065 Thermal GelDOWSIL TC-4040 Dispensable Thermal PadDOWSIL TC-4515 Thermally Conductive Gap FillerDOWSIL TC-4525 Thermally Conductive Gap FillerDOWSIL TC-4535 CV Thermally Conductive Gap FillerDOWSIL TC-5150 Thermally Conductive Gap FillerDOWSIL TC-5550 Thermal Conductive Compound DOWSIL TC-6010 Thermally Conductive EncapsulantELECTROLUBE ER2074 – Epoxy ResinELECTROLUBE ER2183 – Epoxy ResinELECTROLUBE HTC – Non-silicone Heat Transfer CompoundELECTROLUBE HTCP – Heat Transfer Compound Plus - Non SiliconeELECTROLUBE HTCPX – Non-Silicone Heat Transfer Compound PLUS XtraELECTROLUBE HTCPX_LV12.5K – Non-Silicone Heat Transfer Plus - Low ViscosityELECTROLUBE HTCX – Heat Transfer Compound Xtra - Non SiliconeELECTROLUBE HTS – Silicone Heat Transfer CompoundELECTROLUBE HTSP – Silicone Heat Transfer Compound PlusELECTROLUBE TBS – Thermal Bonding SystemELECTROLUBE TCOR – Thermally Conductive Oxime RTVThermal management solutions

EN AT DE CZ HU SI SK HR 

DOW

DOWSIL TC-5150 THERMALLY CONDUCTIVE GAP FILLER

Pošalji upit za ovaj proizvod!

DOWSIL  TC-5150 Thermally Conductive Gap Filler is a high performance, one-part, non- curable, dispensable thermally conductive gap filler with 5 W/mK thermal conductivity, and like other Dow  thermally conductive compounds, is made with silicone materials heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity and high temperature stability. 

The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device to the heat sink or chassis, thereby increasing the overall efficiency of the device.

Applications:

• On board chargers
• Central processing units (CPUs)
• Memory and power modules
• Telecom base stations
• Automotive Electronic Control Units (ECU)
• Processors & Microprocessors
• Power Electronics
• Power supplies and semiconductors

Benefits:

• High thermal conductivity
• Easy to dispense
• Form-in-place
• No additional curing process required
• Low thermal impedance
• Reworkable
• Room temperature storage

Pdf:

• TDS DOWSIL TC 5150 Thermally Conductive Gap Filler eng.pdf