DOWSIL TC-4525 Thermally Conductive Gap Filler

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DOWSIL TC-4525 THERMALLY CONDUCTIVE GAP FILLER

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DOWSIL TC-4525 is a 2.5 W/m·K Silicone Gap Filler material for automotive applications, it is a two part  room temperature curing material.

APPLICATIONS

• DOWSIL™ TC-4525 Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from components mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.
• This material is specifically designed for a smooth assembly process line integration ideally

FEATURES & BENEFITS

• Thermal conductivity: 2.5 W/m·K
• Room temperature cure
• Long term performance stability during temperature cycling up to 150°C
• Withstand peak exposure at 200°C
• Holds vertical position (cured or uncured state)
• UL 94 V-0 certification
• Glass Beads option (180 micron)
• Control volatility option available

Pdf:

• TDS DOWSIL TC 4525 Thermally Conductive Gap Filler eng.pdf