DOWSIL TC-4040 Dispensable Thermal Pad

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Izaberi proizvodDIATHERM Thermal PadsDOWSIL TC-3065 Thermal GelDOWSIL TC-4040 Dispensable Thermal PadDOWSIL TC-4515 Thermally Conductive Gap FillerDOWSIL TC-4525 Thermally Conductive Gap FillerDOWSIL TC-4535 CV Thermally Conductive Gap FillerDOWSIL TC-5150 Thermally Conductive Gap FillerDOWSIL TC-5550 Thermal Conductive Compound DOWSIL TC-6010 Thermally Conductive EncapsulantELECTROLUBE ER2074 – Epoxy ResinELECTROLUBE ER2183 – Epoxy ResinELECTROLUBE HTC – Non-silicone Heat Transfer CompoundELECTROLUBE HTCP – Heat Transfer Compound Plus - Non SiliconeELECTROLUBE HTCPX – Non-Silicone Heat Transfer Compound PLUS XtraELECTROLUBE HTCPX_LV12.5K – Non-Silicone Heat Transfer Plus - Low ViscosityELECTROLUBE HTCX – Heat Transfer Compound Xtra - Non SiliconeELECTROLUBE HTS – Silicone Heat Transfer CompoundELECTROLUBE HTSP – Silicone Heat Transfer Compound PlusELECTROLUBE TCOR – Thermally Conductive Oxime RTVThermal management solutions

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DOWSIL TC-4040 DISPENSABLE THERMAL PAD

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DOWSIL TC-4040 is a two-part, 1-to-1 mix ratio, blue color, thermally conductive dispensable thermal pad. It’s printable or dispensable to cure as a soft thermal gel to replace fabricated thermal pad for thermal transferring, stress relieving and shock damping. It could also be used as gap filler with reworkable performance.   

Features & Benefits

• Liquid and curable thermal gel to form a soft thermal pad to help gap filling, heat dissipating, stress relieving and shock damping 
• 4.0 W/mk thermal conductivity to help device thermal design 
• Dispensed or printed through a variety of manual or automated processes 
• Room temperature or heat to accelerate curing 
• UL listing: UL94 V0 
• Lower cost of ownership than fabricated pad  

Pdf:

• TDS DOWSIL TC 4040 Dispensable Thermal Pad eng.pdf